| 职位名称: | Sr. Process Engineer-Development | 工作地点: | 上海,上海 |
| 招聘人数: | 1 | 职能类别: | 生产/工程技术,技术/工艺设计工程师 |
| 年龄要求: | 22-40 | 工作性质: | 全职 |
| 学历要求: | 硕士 | 工作年限: | 5-7年 |
| 外语要求: | 英语,良好 | 专业要求: | 无要求 |
| 性别要求: | 不限 | 计算机要求: | 无要求 |
| 有效期: | 长期有效 | 发布日期: | 2015/9/22 13:21:52 |
| 简历投递邮箱地址: | recruitment@finisar.com | ||
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| 职位描述: | KEY JOB DUTIES & RESPONSIBILITIES:
1. Be responsible for advanced fiber-optical package front end process technology development and study including Cu Pillar Flip Chip Process, thermocompression bond process and laser eutectic etc 2. Be responsible for advanced manufacture assembly platform development such as high efficiency DFB COC platform including 4T COC eutectic die bonding and COC auto stitch bond bond platform etc; 3. Be responsible for LW parallel ceramic TO OSA front end process development including QSFP 4XLR OSA, 32G FC OSA, 25/28G OSA, QSFP LR4 Gen2 and 25/28G BH laser COC etc. 4. Be responsible for OSA c 5. Be responsible for SBR support from SHG R&D pilot line for overall R&D sides and project; SKILLS/QUALIFICATIONS (include Education, Skills & Experience): 1. Bachelor degree or above in Material Engineer, Mechanical Engineering or related engineering discipline; 2. Minimum 5 years relevant experience in semiconductor or laser/fiber optics package process development/NPI/manufacture. 3. Be familiar with semiconductor or fiber-optical package process and deep understanding assembly process technology and assembly tool/platform for key process such as eutectic bond, epoxy bond, flip chip, SMT and reflow etc; 4. Have assembly process development project or NPI project management experience; 5. Be master of DFM,SPC, DFMEA/PFMEA, Process Failure Analysis and DOE; 6. Good communication capability in spoken and written Chinese and English. 7. Good problem solving, interpersonal and analytical skills. 8. Willing to oversea travel for globe projects/sites support |
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